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 NUD3124 Automotive Inductive Load Driver
This MicroIntegrationt part provides a single component solution to switch inductive loads such as relays, solenoids, and small DC motors without the need of a free-wheeling diode. It accepts logic level inputs, thus allowing it to be driven by a large variety of devices including logic gates, inverters, and microcontrollers.
Features http://onsemi.com
* Provides Robust Interface between D.C. Relay Coils and Sensitive * * * * *
Logic Capable of Driving Relay Coils Rated up to 150 mA at 12 Volts Replaces 3 or 4 Discrete Components for Lower Cost Internal Zener Eliminates Need for Free-Wheeling Diode Meets Load Dump and other Automotive Specs Pb-Free Package is Available
3 1 2 SOT-23 CASE 318 STYLE 21
MARKING DIAGRAMS
JW6 D
JW6 = Specific Device Code D = Date Code
Typical Applications
* Automotive and Industrial Environment * Drives Window, Latch, Door, and Antenna Relays
Benefits
6 1 SC-74 CASE 318F STYLE 7
JW6 D
* * * *
Reduced PCB Space Standardized Driver for Wide Range of Relays Simplifies Circuit Design and PCB Layout Compliance with Automotive Specifications
INTERNAL CIRCUIT DIAGRAMS Drain (3) Drain (6)
JW6 = Specific Device Code D = Date Code
Drain (3)
Gate (1)
10 k 100 K
Gate (2)
10 k 100 K
10 k 100 K
Gate (5)
Source (2) CASE 318
Source (1)
Source (4) CASE 318F ORDERING INFORMATION Device Package SOT-23 SOT-23 (Pb-Free) SC-74 Shipping 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel
NUD3124LT1 NUD3124LT1G NUD3124DMT1
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D.
(c) Semiconductor Components Industries, LLC, 2004
1
June, 2004 - Rev. 8
Publication Order Number: NUD3124/D
NUD3124
MAXIMUM RATINGS (TJ = 25C unless otherwise specified)
Symbol VDSS VGSS ID EZ Drain-to-Source Voltage - Continuous (TJ = 125C) Gate-to-Source Voltage - Continuous (TJ = 125C) Drain Current - Continuous (TJ = 125C) Single Pulse Drain-to-Source Avalanche Energy (For Relay's Coils/Inductive Loads of 80 W or Higher) (TJ Initial = 85C) Peak Power Dissipation, Drain-to-Source (Notes 1 and 2) (TJ Initial = 85C) Load Dump Suppressed Pulse, Drain-to-Source (Notes 3 and 4) (Suppressed Waveform: Vs = 45 V, RSOURCE = 0.5 W, T = 200 ms) (For Relay's Coils/Inductive Loads of 80 W or Higher) (TJ Initial = 85C) Inductive Switching Transient 1, Drain-to-Source (Waveform: RSOURCE = 10 W, T = 2.0 ms) (For Relay's Coils/Inductive Loads of 80 W or Higher) (TJ Initial = 85C) Inductive Switching Transient 2, Drain-to-Source (Waveform: RSOURCE = 4.0 W, T = 50 ms) (For Relay's Coils/Inductive Loads of 80 W or Higher) (TJ Initial = 85C) Reverse Battery, 10 Minutes (Drain-to-Source) (For Relay's Coils/Inductive Loads of 80 W or more) Dual Voltage Jump Start, 10 Minutes (Drain-to-Source) Human Body Model (HBM) According to EIA/JESD22/A114 Specification Rating Value 28 12 150 250 Unit V V mA mJ
PPK ELD1
20 80
W V
ELD2
100
V
ELD3
300
V
Rev-Bat Dual-Volt ESD 1. 2. 3. 4.
-14 28 2,000
V V V
Nonrepetitive current square pulse 1.0 ms duration. For different square pulse durations, see Figure 2. Nonrepetitive load dump suppressed pulse per Figure 3. For relay's coils/inductive loads higher than 80 W, see Figure 4.
THERMAL CHARACTERISTICS
Symbol TA TJ TSTG PD PD RqJA Operating Ambient Temperature Maximum Junction Temperature Storage Temperature Range Total Power Dissipation (Note 5) Derating above 25C Total Power Dissipation (Note 5) Derating above 25C Thermal Resistance Junction-to-Ambient (Note 5) SOT-23 SC-74 SOT-23 SC-74 Rating Value -40 to 125 150 -65 to 150 225 1.8 380 3.0 556 329 Unit C C C mW mW/C mW mW/C C/W
5. Mounted onto minimum pad board.
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NUD3124
ELECTRICAL CHARACTERISTICS (TJ = 25C unless otherwise specified)
Characteristic OFF CHARACTERISTICS Drain to Source Sustaining Voltage (ID = 10 mA) Drain to Source Leakage Current (VDS = 12 V, VGS = 0 V) (VDS = 12 V, VGS = 0 V, TJ = 125C) (VDS = 28 V, VGS = 0 V) (VDS = 28 V, VGS = 0 V, TJ = 125C) Gate Body Leakage Current (VGS = 3.0 V, VDS = 0 V) (VGS = 3.0 V, VDS = 0 V, TJ = 125C) (VGS = 5.0 V, VDS = 0 V) (VGS = 5.0 V, VDS = 0 V, TJ = 125C) ON CHARACTERISTICS Gate Threshold Voltage (VGS = VDS, ID = 1.0 mA) (VGS = VDS, ID = 1.0 mA, TJ = 125C) Drain to Source On-Resistance (ID = 150 mA, VGS = 3.0 V) (ID = 150 mA, VGS = 3.0 V, TJ = 125C) (ID = 150 mA, VGS = 5.0 V) (ID = 150 mA, VGS = 5.0 V, TJ = 125C) Output Continuous Current (VDS = 0.25 V, VGS = 3.0 V) (VDS = 0.25 V, VGS = 3.0 V, TJ = 125C) Forward Transconductance (VDS = 12 V, ID = 150 mA) DYNAMIC CHARACTERISTICS Input Capacitance (VDS = 12 V, VGS = 0 V, f = 10 kHz) Output Capacitance (VDS = 12 V, VGS = 0 V, f = 10 kHz) Transfer Capacitance (VDS = 12 V, VGS = 0 V, f = 10 kHz) SWITCHING CHARACTERISTICS Propagation Delay Times: High to Low Propagation Delay; Figure 1, (VDS = 12 V, VGS = 3.0 V) Low to High Propagation Delay; Figure 1, (VDS = 12 V, VGS = 3.0 V) High to Low Propagation Delay; Figure 1, (VDS = 12 V, VGS = 5.0 V) Low to High Propagation Delay; Figure 1, (VDS = 12 V, VGS = 5.0 V) Transition Times: Fall Time; Figure 1, (VDS = 12 V, VGS = 3.0 V) Rise Time; Figure 1, (VDS = 12 V, VGS = 3.0 V) Fall Time; Figure 1, (VDS = 12 V, VGS = 5.0 V) Rise Time; Figure 1, (VDS = 12 V, VGS = 5.0 V) ns tPHL tPLH tPHL tPLH - - - - 890 912 324 1280 - - - - ns tf tr tf tr - - - - 2086 708 556 725 - - - - Ciss Coss Crss - - - 32 21 8.0 - - - pf pf pf VGS(th) 1.3 1.3 RDS(on) - - - - IDS(on) 150 140 gFS - 200 - 500 - - - mmho - - - - 1.4 1.7 0.8 1.1 mA 1.8 - 2.0 2.0 W V VBRDSS IDSS - - - - IGSS - - - - - - - - 60 80 90 110 - - - - 0.5 1.0 50 80 mA 28 34 38 V mA Symbol Min Typ Max Unit
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NUD3124
TYPICAL PERFORMANCE CURVES
(TJ = 25C unless otherwise noted) VIH Vin 50% 0V tPHL 90% Vout 50% 10% VOL tr tPLH VOH
tf
Figure 1. Switching Waveforms
25 Ppk, PEAK SURGE POWER (W)
20
15
10
5 0 1 10 PW, PULSE WIDTH (ms) 100
Figure 2. Maximum Non-repetitive Surge Power versus Pulse Width
Load Dump Pulse Not Suppressed: VR = 13.5 V Nominal 10% VS = 60 V Nominal 10% T = 300 ms Nominal 10% TR = 1 - 10 ms 10% Load Dump Pulse Suppressed: NOTE: Max. Voltage DUT is exposed to is NOTE: approximately 45 V. VS = 30 V 20% T = 150 ms 20%
TR 90% 10% of Peak; Reference = VR, IR 10% VR, IR
VS
T
Figure 3. Load Dump Waveform Definition
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NUD3124
140 IDSS, DRAIN LEAKAGE (mA) VS, LOAD DUMP (VOLTS) 14 12 10 VDS = 28 V 8 6 4 2 0 -50 -25 0 25 50 75 100 125
120
100
80
60 40 80 110 140 170 200 230 260 290 320 350 RELAY'S COIL (W)
TJ, JUNCTION TEMPERATURE (C)
Figure 4. Load Dump Capability versus Relay's Coil dc Resistance
Figure 5. Drain-to-Source Leakage versus Junction Temperature
80 BVDSS BREAKDOWN VOLTAGE (V) IGSS GATE LEAKAGE (mA) 70 60 VGS = 5 V 50 40 VGS = 3 V 30 20 -50
34.8 34.6 34.4 34.2 34.0 33.8 33.6 33.4 -50 -25 0 25 50 75 100 125 ID = 10 mA
-25
0
25
50
75
100
125
TJ, JUNCTION TEMPERATURE (C)
TJ, JUNCTION TEMPERATURE (C)
Figure 6. Gate-to-Source Leakage versus Junction Temperature
Figure 7. Breakdown Voltage versus Junction Temperature
1 0.01
VGS = 5 V ID DRAIN CURRENT (A)
1 VDS = 0.8 V 0.1 VGS = 3 V VGS = 2.5 V VGS = 2 V 125 C
ID DRAIN CURRENT (A)
0.01 0.001
1E-04
85 C 25 C -40 C
1E-06 VGS = 1 V
1E-04 1E-05 1E-06
1E-08
1E-10 0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
1E-07 0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
VDS, DRAIN-TO-SOURCE VOLTAGE (V)
VGS, GATE-TO-SOURCE VOLTAGE (V)
Figure 8. Output Characteristics
Figure 9. Transfer Function
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NUD3124
1800 1600 1400 1200 1000 800 600 400 -50 ID = 0.15 A VGS = 5.0 V -25 0 25 50 75 100 125 ID = 0.25 A VGS = 3.0 V 0.20 0.18 0.16 0.14 0.12 0.10 0.08 0.06 0.04 0.02 0.00 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 125 C 85 C 25 C -40 C
RDS(ON), DRAIN-TO-SOURCE RESISTANCE (mW)
RDS(ON), DRAIN-TO-SOURCE RESISTANCE (W)
ID = 250 mA
ID = 0.15 A VGS = 3.0 V
TJ, JUNCTION TEMPERATURE (C)
VGS, GATE-TO-SOURCE VOLTAGE (V)
Figure 10. On Resistance Variation versus Junction Temperature
Figure 11. On Resistance Variation versus Gate-to-Source Voltage
36.0 VZ ZENER CLAMP VOLTAGE (V) 35.5 35.0 34.5 34.0 33.5 33.0 32.5 32.0 0.1 1.0 10 100 1000 125 C -40 C 25 C 85 C
IZ, ZENER CURRENT (mA)
Figure 12. Zener Clamp Voltage versus Zener Current
1.0 r(t), TRANSIENT THERMAL RESISTANCE (NORMALIZED)
D = 0.5 0.2 0.1
0.1
0.05 Pd(pk) 0.02 0.01
0.01
SINGLE PULSE
PW
t1 t2 PERIOD
DUTY CYCLE = t1/t2
0.001 0.01
0.1
1.0
10
100 t1, PULSE WIDTH (ms)
1000
10,000
100,000
1,000,000
Figure 13. Transient Thermal Response for NUD3124LT1
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6
NUD3124
APPLICATIONS INFORMATION
12 V Battery - +
Relay, Vibrator, or Inductive Load Drain (3)
NO
NC
Gate (1) Micro Processor Signal for Relay
10 k
100 K
NUD3124
Source (2)
Figure 14. Applications Diagram
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NUD3124
PACKAGE DIMENSIONS
SOT-23 (TO-236) CASE 318-08 ISSUE AH
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. 318-03 AND -07 OBSOLETE, NEW STANDARD 318-08.
A L
3 1 2
BS
V
G C D H K J
DIM A B C D G H J K L S V
INCHES MIN MAX 0.1102 0.1197 0.0472 0.0551 0.0350 0.0440 0.0150 0.0200 0.0701 0.0807 0.0005 0.0040 0.0034 0.0070 0.0140 0.0285 0.0350 0.0401 0.0830 0.1039 0.0177 0.0236
MILLIMETERS MIN MAX 2.80 3.04 1.20 1.40 0.89 1.11 0.37 0.50 1.78 2.04 0.013 0.100 0.085 0.177 0.35 0.69 0.89 1.02 2.10 2.64 0.45 0.60
STYLE 21: PIN 1. GATE 2. SOURCE 3. DRAIN
SOLDERING FOOTPRINT*
0.95 0.037
0.95 0.037
2.0 0.079 0.9 0.035 0.8 0.031
SCALE 10:1 mm inches
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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NUD3124
PACKAGE DIMENSIONS
SC-74 CASE 318F-05 ISSUE K
A L
6 5 1 2 4 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. 318F-01, -02, -03 OBSOLETE. NEW STANDARD 318F-04. DIM A B C D G H J K L M S INCHES MIN MAX 0.1142 0.1220 0.0512 0.0669 0.0354 0.0433 0.0098 0.0197 0.0335 0.0413 0.0005 0.0040 0.0040 0.0102 0.0079 0.0236 0.0493 0.0649 0_ 10 _ 0.0985 0.1181 MILLIMETERS MIN MAX 2.90 3.10 1.30 1.70 0.90 1.10 0.25 0.50 0.85 1.05 0.013 0.100 0.10 0.26 0.20 0.60 1.25 1.65 0_ 10 _ 2.50 3.00
S
3
B
D G M 0.05 (0.002) H C K J
STYLE 7: PIN 1. SOURCE 1 2. GATE 1 3. DRAIN 2 4. SOURCE 2 5. GATE 2 6. DRAIN 1
RECOMMENDED FOOTPRINT
2.4 0.094
1.9 0.074 0.7 0.028
0.95 0.037 0.95 0.037
1.0 0.039
SCALE 10:1
mm inches
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NUD3124
MicroIntegration is a trademark of Semiconductor Components Industries, LLC (SCILLC)
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082-1312 USA Phone: 480-829-7710 or 800-344-3860 Toll Free USA/Canada Fax: 480-829-7709 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Phone: 81-3-5773-3850 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative.
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NUD3124/D


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